CoolSem Technologies, a semiconductor thermal management company, has closed a pre-seed
funding round led by High-Tech Gründerfonds (HTGF), with participation from KBC
Focus Fund NV, the Brabant Development Agency (BOM), and TTT Green Tech B.V.
(SHIFT Invest).
As chips
become an increasingly critical resource, pressure on raw materials is rising, and heat management remains a persistent constraint on performance. CoolSem
Technologies aims to address these challenges by improving energy efficiency,
extending hardware lifetimes, and enabling the reuse of scarce materials,
supporting a more sustainable and circular semiconductor industry.
Founded
in 2025 and headquartered in Eindhoven, the Netherlands, CoolSem Technologies
develops wafer-level thermal management solutions for advanced semiconductor
and photonic devices. Its WaLTIS multilayer stack replaces conventional
substrates with an engineered structure designed to improve heat dissipation,
mechanical stability, and device reliability, enabling higher performance and
longer device lifetimes.
Commenting
on the funding, CoolSem Technologies’ CEO, André van Geelen, said that thermal
constraints are increasingly limiting semiconductor performance, particularly
in RF, photonics, and power applications, where traditional materials and
packaging approaches are nearing their physical limits.
Olaf Joeressen, Senior
Investment Manager at HTGF, added that the technology has the potential to
become a core component of future chip thermal design, as thermal management
becomes ever more critical to semiconductor performance.
The company will use the funding to advance its WaLTIS
technology from concept to engineering samples, with validation by leading
customers in RF, power, and photonics, supporting qualification activities and
real-world performance testing.